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High-speed flexible mounter ke-2080
The ultra-flexible KE-2080 can place a wide range of components from 0402 (01005) and ICs, to odd-form,
All at industry leading accuracy and speed.

Chip
20, 200CPH(laser centering/Optimum)(0.178Sec. /chip)
16, 700CPH(laser centering/IPC9850)
IC
1, 850CPH (vision centering / effective tact)
4, 860CPH with MNVC option.

One multi-nozzle laser head (6 nozzles) plus one high resolution head (1 nozzle)
From 0402 (01005) to 74mm square components or 50× 150mm
Vision centering system (featuring bottom, side, and back lighting, all ball recognition and split recognition)
1 Actual throughput may vary.
2 Please download brochure for details.

Board size: M size (330× 250mm)
L size (410× 360mm)
L-Wide size(510× 360mm) (option)
E size (510× 460mm)*1
Component size
Laser recognition: 0402 (01005)~33.5mm
Vision recognition
Standard camera: 3mm~74mm or 50× 150mm
High-resolution camera (option): 1.0× 0.5mm*3~48mm or 24× 72mm
Placement speed
Chip
Optimum: 0.178Sec. /chip(20, 200CPH)
IPC9850: 16, 700CPH
IC*4: 1, 850CPH
4, 860CPH*5
Placement accuracy
Laser recognition: ± 0.05mm(Cpk1)
Vision recognition: ± 0.03mm (± 0.04mm when using MNVC)
Feeder inputs: Max. 80 on 8mm T/F*6

1 Please ask for details on E size board.
2 When using MNVC. (option)
3 When using high-resolution camera. (option)
4 Effective tact: The IC placement speed indicates an estimated value obtained when the machine places 36 QFP (100 pins or more) or BGA components (256 balls or more) on a M size board.
(CPH=number of components placed for one hour)
5 Estimated value when using MNVC (option) and picking up components simultaneous with all nozzles.
6 Including matrix tray changer, max 110.